Wafer in a sentence

Historical increases of wafer size A unit wafer fabrication step, such as an etch step, can produce more chips proportional to the increase in wafer area, while the cost of the unit fabrication step goes up more slowly than the wafer area.

Wafer test metrology equipment is used to verify that the wafers haven't been damaged by previous processing steps up until testing; if too many dies on one wafer have failed, the entire wafer is scrapped to avoid the costs of further processing.

Aehr can not only provide precise regulating calibrated voltage in current devices on a wafer up to 3500 Watts per wafer and nine wafers at a time, but we can also remove this power while maintaining a uniform temperature across all the wafers.

It transfers a circuit image to a silicon wafer by exposing both silicon wafer and photo mask to ultraviolet light.

A viscous, liquid solution of photoresist is dispensed onto the wafer, and the wafer is spun rapidly to produce a uniformly thick layer.

Both contact and proximity lithography require the light intensity to be uniform across an entire wafer, and the mask to align precisely to features already on the wafer.

For some applications, the separation is preceded by wafer backgrinding in order to reduce the wafer thickness.

In order to get the impure atoms embedded in the silicon wafer, the wafer is first put in a 1100 degree Celsius chamber.

Ion implantation depths depend on the wafer's crystal orientation, since each direction offers distinct paths for transport. citation Wafer cleavage typically occurs only in a few well-defined directions.

Scoring the wafer along cleavage planes allows it to be easily diced into individual chips (" dies ") so that the billions of individual circuit elements on an average wafer can be separated into many individual circuits.

Since fabrication costs for a semiconductor wafer are relatively fixed, the cost per integrated circuits is mainly related to the number of chips that can be produced per wafer.

This allows electrically charged particles time to recombine before they reach the wafer surface, and prevents damage to the wafer surface.

Thus, the top layer of resist is quickly ejected from the wafer's edge while the bottom layer still creeps slowly radially along the wafer.

Wafer test The highly serialized nature of wafer processing has increased the demand for metrology in between the various processing steps.

Wafer thickness is determined by the mechanical strength of the material used; the wafer must be thick enough to support its own weight without cracking during handling.

While CCDs may be manufactured on a heavily doped p++ wafer it is also possible to manufacture a device inside p-wells that have been placed on an n-wafer.

But Mumbai’s main headache lies in their wafer-thin bowling attack.

By contrast, the is just a crisp, visible morsel carved out of a silicon wafer.

Infineon Technologies () is constructing a new state-of-the-art wafer fab module in Kulim, with around Ringgit 8 billion of investment.

It had a respectable 30 mph top speed but suffered heavily in the Battle of France with its wafer-thin armor.